|
|
TM 11-6625-2975-40
EQUIPMENT DATA. (CONT)
1-11.
SPECIFICATION
CHARACTERISTIC
I
Marker Beacon (MB)
<1.0 percent
Distortion (audio)
Amplitude modulation
Range
95.0 percent
Preset
Variable
90.0 to 97.0 percent, in 0.1-percent increments
5 percent
Accuracy
<4 percent
Tone distortion
Be sure to obey all warnings, cautions, and notes given in this manual. Failure to follow directions
may result in serious injury to personnel and/or damage to equipment.
section Ill PRINCIPLES OF OPERATION
Page
Para
Subject
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13
System Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
Microprocessor (CPU) Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Front Panel Assembly Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
Audio Modulation Generator Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 1-17
RF Section Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 1-18
Power Supply Assembly Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
1-13. GENERAL.
This section contains information covering principles of operation of the major electronic assemblies
of the test set. The material is presented in functional block diagram format, with supporting text which
explains the operation of each assembly.
Details pertaining to the operation of individual components in each assembly are not discussed In this
section. Instead, the text is intended to explain how each assembly contributes to the operation of the
test set.
At the General Support level of maintenance, electronic components within test set assemblies are
not replaced. Because of this maintenance approach, this section does not discuss the performance
of specific circuits and components such as diodes, transistors, etc. In fact, it is not necessary to
understand how the circuits in an assembly operate to effectively troubleshoot or aline it. However, it
is very important to know what an assembly actually does in order to perform signal checks at test
points for the purpose of testing, troubleshooting, or alining the assembly.
A detailed system block diagram is found in FO-2 in the back of this manual. Refer to this foldout while
reading the following text.
|
Privacy Statement - Press Release - Copyright Information. - Contact Us |