EQUIPMENT DATA. - TM-11-6625-2975-400012

TM 11-6625-2975-40

1-10.

LOCATION AND DESCRIPTION OF MAJOR COMPONENTS. (CONT)

3. RF Modulator Assembly A3. Located behind front panel assembly A1, combines carrier fre-

quency with audio modulation signal to produce a simulated ground station signal.

4. Synthesizer Assembly A4. Located between front panel assembly A1 and rf modulator assembly

A3, produces test set-selected carrier frequency.

5. Power Supply Assembly A5. Located at rear of test set, supplies all voltages required for test

set operation.

6. Chassis Assembly A6. Consists of test set's interconnecting wiring and digitally-controlled

attenuator. Digitally-controlled attenuator A6AT1, located directly behind front panel

RF OUT connector, determines amount of attenuation required to provide an rf output signal

with selected output level.

1-11.

EQUIPMENT DATA.

TM 11-6625-2975-12 contains a complete list of the test set's physical and environmental specifi-

cations and those electronic specifications needed to support lower level maintenance. The following

list contains additional electronic data needed for general support maintenance.

SPECIFICATION

CHARACTERISTIC

Very High Frequency Omnidirectional

Range (VOR) Mode

Modulation Tones

Distortion (audio)

30 Hz reference and 30 Hz

0.25 percent

variable

0.50 percent

9960 Hz and 1020 Hz

480 Hz 2 Hz peak

9960 Hz FM deviation

Amplitude Modulation

Range (per tone)

Preset (1020 Hz, 30 Hz variable,

30.0 percent

9960 Hz)

10.0 to 35.0 percent in 0.1-percent increments

Variable

2.5 percent of indicated modulation for present

Accuracy

mode

Tone distortion (at 30 percent

modulation)

<1.0 percent

30 Hz Variable

9960 Hz

<1.5 percent

1020 Hz

<1.0 percent

VOR Radial Accuracy

0.01 degree of selected radial

Localizer (LOC) and Glide Slope (GS) Mode

Modulation Tones

Distortion (audio)

< 0.25 percent

90 and 150 Hz

<0.50 percent

1020 Hz

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