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TM 1-6625-735-14
3.2.
SCOPE.
troubleshooting and malfunction information and test
for locating and correcting most of the troubles which
intermediate maintenance troubleshooting or malfunc-
may occur in the test set, stabilization system.
tion information and tests for locating and correcting
most of the troubles which may occur in the test set.
TESTING UPPER PANEL ASSEMBLY.
Each test procedure provides indications whereby
Check for continuity between connector pins and test
portions of a circuit are proven acceptable or trouble-
point connections listed in Table 3-1. Refer to Figure
shooting can be done. Troubleshooting is directly
related to test procedures to assist in isolating a spe-
not exist, repair wiring, Figure 58.
cific subassembly or component malfunction. Refer to
TESTING LOWER PANEL ASSEMBLY.
cannot list all possible malfunctions which may occur
find during the operation or maintenance of the test
or all tests or inspections and corrective actions. If a
set or its components. You shall do the tests/
malfunction is not listed (except when malfunction
inspections and corrective actions in the order listed.
and cause are obvious), or is not corrected by listed
Each malfunction or trouble symptom for an indi-
corrective actions, you shall notify higher level main-
vidual component, unit, or system is followed by a list
tenance. You shall do the test/inspections and correc-
of testing/checkout procedures necessary for deter-
tive actions in the order listed.
mining probable cause of malfunction. Corrective
actions are listed below the testing/checkout proce-
TROUBLESHOOTING TEST SET.
dure when an operational check is not as specified.
See Figure 5-10. for lower panel assembly schematic
diagram. Refer to Figure 59. for lower panel assem-
not make electrical connections or apply power to the
bly wiring diagram.
test set unless instructed to do so. Standard test equip-
ment is listed in Appendix B, section III.
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