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TM 11-6625-3023-14/ET904-AA-MMA-010/E154 TS3684/TO 33A1-12-1173-1
a. Removal. Perform the following procedure to remove any of the five toggle switches:
(1) Remove the panel assembly as described in paragraph 6-8a.
(2) Tag, unsolder, and remove connecting wires to toggle switch.
(3) Remove nut and lockwasher securing toggle switch to panel assembly and remove toggle switch.
b. Replacement. Perform the following procedure to replace either of the five toggle switches:
(1) Install toggle switch and lockwasher on panel assembly and secure with nut.
(2) Install and solder wires as tagged.
(3) Replace panel assembly as described in paragraph 6-8b.
6-10. Zener Diode. The zener diode(s) (D3 and D4) may be removed and replaced by performing the following
procedures.
a. Removal. Perform the following procedure to remove a zener diode:
(1) Remove the panel assembly as described in paragraph 6-8a.
CAUTION
Overheating may destroy the thermal conductivity of the copper pad bonding agent or loosen the pad.
b. Replacement. Perform the following procedure to replace the zener diode:
(1) Install zener diode with associated heat sink (OBSERVE POLARITY) and solder.
CAUTION
Repeated heating may destroy thermal conductivity of copper pad bonding agent or loosen the pad.
(2) Replace panel assembly as described in paragraph 6-8b.
6-11. Rotary Switch. The rotary switch (S4) located on the test set panel assembly may be removed and replaced by
performing the following procedures.
a. Removal. Perform the following procedure to remove the rotary switch:
6-20
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