Figure 6-5. Left-rear view, SAS bench test set.

C1, TM 11-6625-646-15

Figure 6-5. Left-rear view, SAS bench test set.

CAUTION

d. Replace a defective part as follows:

Do not apply heat longer than

(1) Remove the protective coating as

necessary, prolonged heating may

directed in step b.

damage the printed-wiring card. If

(2) Apply heat at the component mounting

heating causes the conductor to

holes until the solder is melted. Then remove the

separate from the board, discard the

component and wire leads.

card.

(4) Coat the repaired area with protective coating as

CAUTION

directed in b above.

Do not apply heat longer than