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TM 11-6625-2975-40
1-10.
LOCATION AND DESCRIPTION OF MAJOR COMPONENTS. (CONT)
3. RF Modulator Assembly A3. Located behind front panel assembly A1, combines carrier fre-
quency with audio modulation signal to produce a simulated ground station signal.
4. Synthesizer Assembly A4. Located between front panel assembly A1 and rf modulator assembly
A3, produces test set-selected carrier frequency.
5. Power Supply Assembly A5. Located at rear of test set, supplies all voltages required for test
set operation.
6. Chassis Assembly A6. Consists of test set's interconnecting wiring and digitally-controlled
attenuator. Digitally-controlled attenuator A6AT1, located directly behind front panel
RF OUT connector, determines amount of attenuation required to provide an rf output signal
with selected output level.
EQUIPMENT DATA.
TM 11-6625-2975-12 contains a complete list of the test set's physical and environmental specifi-
cations and those electronic specifications needed to support lower level maintenance. The following
list contains additional electronic data needed for general support maintenance.
SPECIFICATION
CHARACTERISTIC
Very High Frequency Omnidirectional
Range (VOR) Mode
Modulation Tones
Distortion (audio)
30 Hz reference and 30 Hz
0.25 percent
variable
0.50 percent
9960 Hz and 1020 Hz
480 Hz 2 Hz peak
9960 Hz FM deviation
Amplitude Modulation
Range (per tone)
Preset (1020 Hz, 30 Hz variable,
30.0 percent
9960 Hz)
.
10.0 to 35.0 percent in 0.1-percent increments
Variable
2.5 percent of indicated modulation for present
Accuracy
mode
Tone distortion (at 30 percent
modulation)
<1.0 percent
30 Hz Variable
9960 Hz
<1.5 percent
1020 Hz
<1.0 percent
VOR Radial Accuracy
0.01 degree of selected radial
Localizer (LOC) and Glide Slope (GS) Mode
Modulation Tones
Distortion (audio)
< 0.25 percent
90 and 150 Hz
<0.50 percent
1020 Hz

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